Global Semiconductor Advanced Packaging Strategic Business Report 2023 – Amkor Technology Leading Packaging Technology Innovation

DUBLIN, Nov. 30, 2023 /PRNewswire/ — The “Semiconductor Advanced Packaging – Global Strategic Business Report” has been added to ResearchAndMarkets.com’s offering.

The global market for Semiconductor Advanced Packaging estimated at US$35.8 Billion in the year 2022, is projected to reach a revised size of US$68 Billion by 2030, growing at a CAGR of 8.3% over the analysis period 2022-2030.

Flip Chip Packaging, one of the segments analyzed in the report, is projected to record 7.9% CAGR and reach US$49.1 Billion by the end of the analysis period. Growth in the 2.5d/3d Packaging segment is estimated at 10.9% CAGR for the next 8-year period.

The U.S. Market is Estimated at $3.3 Billion, While China is Forecast to Grow at 9.8% CAGR

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.3 Billion in the year 2022. China, the world’s second largest economy, is forecast to reach a projected market size of US$19.9 Billion by the year 2030 trailing a CAGR of 9.8% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.9% and 6.8% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.1% CAGR.

Key Market Trends & Drivers

Digital Transformation Drive to Steer Future Growth of Advanced Packaging MarketIoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced PackagingNew Packaging Technologies Crucial to Semiconductor Innovation3D Chip Stacking Technology to Drive Future Advanced Packaging Technology3D InCites – Advanced Packaging for 5G2.5D Packaging Emerges as Powerful Option for Next-Generation AI ProductsAdvanced Packaging Influences Design ChainLed by Innovation, Semiconductor Advanced Packaging Enters into Exciting EraInnovative Advanced Packaging Techniques to Flood the MarketAmkor Technology Leading Packaging Technology InnovationReducing the Cost of Advanced PackagingInvestments in Advanced Packaging: A Critical Component for Resilient Semiconductor Supply ChainTrends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging MarketPost Pandemic Recovery in CE Sector to Augment ProspectsReview of Key CE Products Driving Adoption of Semiconductor Advanced Packaging TechnologyFOWLP and Challenges to Packaging Materials SuppliersAutomobile Electronification Trends Widen the Addressable MarketAnticipated Post COVID Recovery to Revive Opportunities in Aerospace SectorSustained High Growth in ICT Sector Augurs WellFan-Out Packaging: Promises & Key ChallengesImplications of Chiplets & Related Designs for Advanced PackagingSolving Lithography ChallengesSemiconductor Supply Chain: The Complex Nature & VulnerabilitiesVulnerabilities for WBG Power Semiconductors

Select Competitors Featured in the Report

Advanced Micro DevicesApplied MaterialsAvery DennisonAmkor TechnologyAdvantestBrewer ScienceAmerican SemiconductorASM Pacific TechnologyASE Technology Holding.AT & S Austria Technologie & SystemtechniBE Semiconductor IndustriesAmtech MicroelectronicsAPSTLBoschman TechnologiesASE Korea

Key Topics Covered:

1. MARKET OVERVIEW

Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain ModularityAmong the Hammered Companies in the Supply Chain is the “Semiconductor Industry”Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020Semiconductor Trends for Specific End-Use CategoriesCOVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of LifeFalling Consumer Confidence Impacts Sales of Automotive and Consumer ElectronicsIndustrial Activity Remain Subdued in 2020Global PMI Index Points for the Years 2018, 2019 & 2020Competitive ScenarioSemiconductor Supply Chain Transitions at Various LevelsFinancial Performances of Packaging Suppliers Reveals New Growth PlayersUnconventional Players Joining Semiconductor Advanced Packaging BandwagonSemiconductor Advanced Packaging – Global Key Competitors Percentage Market Share in 2022 (E)Semiconductor Advanced Packaging Competitor Market Share Scenario Worldwide (in %): 2020ECompetitive Market Presence – Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)Flip Chip Packaging (Technology) Global Competitor Market Share Positioning for 2020 & 20272.5D/3D Packaging (Technology) Market Share Breakdown of Key Players: 2020 & 2027FI WLP (Technology) Competitor Revenue Share (in %): 2020 & 2027FO WLP (Technology) Market Share Shift by Company: 2020 & 2027Rising Semiconductor Demand Presents Bundle of Joy for Advanced Packaging MarketProminent Factors Stirring Semiconductor Advanced Packaging MarketGlobal Market Prospects & OutlookFlip-Chip: Key Contributing SegmentRising Investments to Benefit MarketKey Trends to Drive Semiconductor Advanced Packaging MarketRegional AnalysisAn Introduction to Semiconductor Advanced PackagingRecent Market Activity

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

For more information about this report visit https://www.researchandmarkets.com/r/2kw5c

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