Global Outsourced Semiconductor Assembly and Test Market Analysis Report 2023: The Rise of Chiplets, OSATs’ Recipe for Success, Smart Manufacturing, AiP for 5G – Forecast to 2027

DUBLIN, Nov. 24, 2023 /PRNewswire/ — The “Global Outsourced Semiconductor Assembly and Test Growth Opportunities” report has been added to ResearchAndMarkets.com’s offering.

This comprehensive study delves into the global outsourced semiconductor assembly and test (OSAT) market, which is poised for substantial growth, primarily driven by the increasing adoption of advanced packaging technology across various industries.

OSATs, or outsourced semiconductor assembly and test providers, are essential third-party partners specializing in assembly, testing, and packaging (ATP) services for integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers.

They offer expertise in both advanced and conventional packaging and testing processes and leverage economies of scale with their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can streamline their operations, reduce time-to-market, and focus on core competencies.

This study specifically focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. It provides comprehensive market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services.

The research takes an in-depth look at various end-user industries, highlighting how OSATs play a crucial role in enabling transformative trends such as electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the influence of industry consolidation and geopolitical factors on the OSAT market.

The primary objective of this study is to identify growth opportunities within this space and evaluate the factors that could either accelerate or impede market growth. It segments the market based on end-user industries, packaging technology, interconnect type, and geography.

To provide comprehensive insights, the research combines findings from discussions with industry experts and stakeholders in the OSAT ecosystem with secondary research data to estimate market size and forecast growth trends through 2027.

Key highlights of the study include insights into regional demand patterns, a detailed analysis of OSAT opportunities within each end-user sector, an examination of capital expenditure trends, OSAT facility distribution, and a thorough exploration of the OSAT value chain. The report also offers a competitive analysis, providing market share data for major players in the industry.

Growth Opportunity Universe

Validation and Verification for HIIndustry 4.0 for Improving Margins and EfficiencyStrategic Upstream and Downstream Efforts3D Printing in Semiconductor PackagingDigital Transformation for Efficiently Tackling ShocksM&As

Key Topics Covered:

1 Strategic Imperatives

Why is it Increasingly Difficult to Grow?The Strategic ImperativeThe Impact of the Top 3 Strategic Imperatives on the Outsourced Semiconductor Assembly and Test (OSAT) IndustryGrowth Opportunities Fuel the Growth Pipeline Engine

2 Growth Opportunity Analysis

Scope of AnalysisClassification of Semiconductor Packaging TechnologyKey Participants in the OSAT Value ChainSegmentation by End UsersThe Rise of ChipletsPackaging Trends in Wide-bandgap (WBG) SemiconductorsHybrid BondingKey CompetitorsGrowth MetricsGrowth DriversGrowth Driver AnalysisGrowth RestraintsGrowth Restraint AnalysisForecast AssumptionsRevenue ForecastRevenue Forecast by End UserRevenue Forecast by Packaging TypeRevenue Forecast by Interconnect TypePackaging Interconnect Technologies – Global Market Share of OSATs, IDMs, and FoundriesRevenue Forecast by RegionOSAT Facilities by RegionRevenue Forecast AnalysisPricing Trends and Forecast AnalysisCompetitive EnvironmentRevenue ShareRevenue Share AnalysisOSAT Landscape – Capex TrendOSAT Landscape – Analysis of Top 25 Pure-play OSATsNotable ATMP Investments GloballyATMP Investment Landscape, 2020-2023OSATs’ Recipe for SuccessAnalysis of CompetitionM&A Analysis

3 Indian OSAT Landscape and Opportunities

Indian Semiconductor IndustryIndian Semiconductor PolicyRevenue Forecast – Indian ATMP LandscapeRevenue Forecast Analysis – ATMP MarketIndian OSAT OpportunitiesIndian ATMP Landscape – Current ScenarioIndia ATMP CapabilitiesDevelopments in the Indian ATMP Sector

4 AI in OSATs

Key Pillars for Implementation of Smart Manufacturing in OSATsAI/ML in Semiconductors Packaging and TestingExisting and Potential AI/ML Solutions for the OSATs/ATMP LandscapeNotable AI/ML Solutions for ATMP – Impact Analysis DashboardCase #1: End-to-End Software Solution for Efficient OSAT OperationsCase #2: Exensio OSAT by PDF Solutions

5 Growth Opportunity Analysis – Mobile & Consumer Electronics

Growth MetricsRevenue ForecastRevenue Forecast by Interconnect TypeRevenue Forecast by Packaging TypeRevenue Forecast by RegionForecast AnalysisAiP for 5GEvolution of RF FEM, Antenna, and Packaging Technology in Smartphones with Network GenerationsCompetitive EnvironmentRevenue Share

6 Growth Opportunity Analysis – Telecom & Infrastructure

Growth MetricsRevenue ForecastRevenue Forecast by Interconnect TypeRevenue Forecast by Packaging TypeRevenue Forecast by RegionForecast AnalysisGlobal 5G Adoption – 2021 and 2025Competitive EnvironmentRevenue Share

7 Growth Opportunity Analysis – Automotive & Transportation

Growth MetricsRevenue ForecastRevenue Forecast by Interconnect TypeRevenue Forecast by Packaging TypeRevenue Forecast by RegionForecast AnalysisCompetitive EnvironmentRevenue Share

8 Growth Opportunity Analysis – Others

Growth MetricsRevenue ForecastRevenue Forecast by Interconnect TypeRevenue Forecast by Packaging TypeRevenue Forecast by RegionForecast AnalysisCompetitive EnvironmentRevenue ShareSustainability in OSATsTop 5 Trends in the Semiconductor Ecosystem for Sustainability and the Circular EconomySemiconductor Ecosystem Alignment with UN SDGs Critical to Paving the Path to DecarbonizationKey Sustainability Factors for OSATsUN SDGsAmkor TechnologyASE Technology

For more information about this report visit https://www.researchandmarkets.com/r/6z05vn

About ResearchAndMarkets.com
ResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.

Media Contact:
Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
 
For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
 
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

Logo: https://mma.prnewswire.com/media/539438/Research_and_Markets_Logo.jpg

 

View original content:https://www.prnewswire.com/news-releases/global-outsourced-semiconductor-assembly-and-test-market-analysis-report-2023-the-rise-of-chiplets-osats-recipe-for-success-smart-manufacturing-aip-for-5g—forecast-to-2027-301997151.html

SOURCE Research and Markets