3D Electronics Printing Market Set to Achieve a Remarkable 10-Year CAGR of 37%, Reaching $7.9 Billion by 2033

DUBLIN, Nov. 8, 2023 /PRNewswire/ — The “3D Printed Electronics 2023: Market Study & Forecast” report has been added to  ResearchAndMarkets.com’s offering.

The 3D electronics printing (3DEP) market is expected to experience significant growth in the coming years. This is due to the advancements in printing technology and platform capability, alongside the ongoing development and demonstration of the applications of 3D electronics printing.

The market is projected to achieve a 10-year CAGR of 37%. The market size for 3D electronics printing is also expanding, with an estimated total market value of $0.3 billion in 2023, which is expected to increase to $7.9 billion by 2033.

This report describes the value propositions of 3DEP, the challenges to market growth, key players in the 3DEP space, and detailed market data and forecasting.

Companies or organizations covered in this report include, but are not limited to: Ceradrop, Nano Dimension, NeoTech, Optomec, FujiFilm, Voltera, BotFactory, nScrypt, J.A.M.E.S., NextFlex, ChemCubed, PV Nanocell, Panasonic, Additive Electronics, Nano3DPrint, and Notion Systems.

Key Topics Covered:

Chapter One: Trends, opportunities and challenges

Background and context to this reportReading this reportTrends, Opportunities, and challenges in the 3D printing electronics spaceThe current and future potential for 3D printing electronics technologies and applicationsMapping the current competitive landscapeBuilding a future view of the industry and forecasting its opportunity for growthThe current 3D printing electronics space3D Electronics Printing prepares to move from the lab to the factoryElectronics prototyping remains the go-to applicationMoving PCB prototyping in-houseStanding at the precipice of commercial 3D printed electronicsNotable trends driving the direction of the industrySustainabilityReducing material consumption in prototypingRecyclability through designMiniaturisation of devices reducing life cycle impactSupply Chain security and compressionSupporting Semiconductor production using conventional 3D printingCreating helpful incentives to produce semiconductors (CHIPs) actOpportunitiesInternet of thingsConformal printing of antenna within IoT devicesVolumetric IoTFlexible IoTLow volume, high mix electronics become increasingly viableMiniaturisation of electronicsOff-setting the limitations of physics through compact circuit designInterconnectsPassivesEmbedded and stacked components and vertically integrated ICsProtecting Intellectual Property via moving to in-house prototypingFreedom of DesignTop, bottom and side-mounted components, adding another angle to circuit boardsHigher density routing with multi-directional viasChallengesVolume productionOvercoming production volume with SMT integration in the print processContinuing materials developmentBuilding a seamless digital thread for 3D printed electronicsDelineation of electronic computer-aided design and mechanical computer-aided design begin to blurEmerging software solutions to bridge the gap

Chapter Two: Technology, Applications and Markets

TechnologiesTechnologies capable of printing conductive materialsPolymer Powder Bed FusionVat PhotopolymerizationTechnologies capable of printing static-dissipative materialsPolymer Powder Bed FusionVat PhotopolymerisationMaterial Extrusion3D Electronic Printing TechnologiesInkjet PrintingAerosol Jet PrintingExtrusion-Based PrintingMaterialsConductive InksSilver Nanoparticle InksExtrusion materials and limitationsDielectric inks and resinsApplicationsPCBs3D printed multi-layer PCBsFuture of printed PCBsConnectors and InterconnectsAntennas, Amplifiers and Transceiver3DEP supporting advanced antenna productionMulti-material printing of next-generation antennaRise of 6GCapacitorsSensorsQuantum sensorsBeyond the PCB: 3DEP innovations in next-generation components and applicationsOptoelectronicsBatteriesLab-on-chips

Chapter Three: Market players

Nano Dimension, Israel, 2012Nano Dimensions attempts to acquire StratasysFinancial performanceTechnology – Dragonfly IVMaterialsPartnershipsOptomec, United States, 1997TechnologyAerosol Jet Printer PortfolioAerosol jet HD2Aerosol Jet AJ FlexAerosol Jet Print EngineBot Factory, United States, 2013Ceradrop, France, 2006Ceradrop TechnologyF-serieX-SerieIndustrial platformChemcubed, United States, 2014NeoTech, Germany, 2006Technology15X BT45XG4PV Nanocell, Israel, 2010Voltera, Canada, 2013Fujifilm Corporation, Japan, 1934TechnologyPanasonic, Japan, 1918Additive Electronics, Germany, 2022Notion Systems, Germany, 2012nScrypt, United States, 2002Nano3DPrint, United States, 2013Entry into the professional space with the D4200S

Chapter Four: Ten year forecasts

For more information about this report visit https://www.researchandmarkets.com/r/30fa9s

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